IEEE Global Communications Conference
4–8 December 2023 // Kuala Lumpur, Malaysia

WS03: Reconfigurable Intelligent Surfaces-Empowered 3CLS for 6G and Beyond Communications

WS03: Reconfigurable Intelligent Surfaces-Empowered 3CLS for 6G and Beyond Communications

The upcoming sixth-generation (6G) wireless networks aim to provide a multi-purpose system that can deliver multiple services, including communications, computing, control, localization, and sensing (3CLS). In the context of 6G, the integration and management of these functions will play a crucial role in the development of various applications such as Multisensory XR Applications, Connected Robotics and Autonomous Systems (CRAS), Wireless Brain-Computer Interactions (BCI), Blockchain and Distributed Ledger Technologies (DLT), and more. To enable these advanced applications, we propose a workshop on reconfigurable intelligent surfaces (RISs) aided 3CLS for 6G networks. RISs are intelligent surfaces that can reconfigure the electromagnetic environment and offer unprecedented flexibility in wireless system design. In this workshop, we will explore the potential of RIS-aided 3CLS in enabling novel applications and use cases in 6G. This workshop aims for bringing together academic and industrial researchers to share the recent breakthroughs related to RIS and discuss the major technical challenges arising in RIS-aided networks. The workshop will also focus on the latest research advances and challenges related to 3CLS-aided systems, such as channel estimation, resource allocation, beamforming design, and optimization techniques. The target audience of this workshop includes researchers, engineers, and practitioners from both academia and industry who are interested in the development of 6G networks and applications. This workshop aims at bringing together academic and industrial researchers to discuss channel coding beyond 5G. Topics of interest include but are not limited to:

  • Reconfigurable intelligent surfaces for 3CLS-enabled wireless communication systems.
  • RIS architectures, implementation, and deployment aspects.
  • Control and sensing techniques for reconfigurable intelligent surfaces in 6G networks.
  • Machine learning and artificial intelligence approaches for reconfigurable intelligent surfaces in wireless communication.
  • Energy-efficient and sustainable design for reconfigurable intelligent surfaces in wireless communication networks.
  • Performance analysis and optimization of 3CLS-enabled wireless communication systems.
  • Security and privacy challenges in reconfigurable intelligent surfaces for wireless communication networks.
  • Applications of reconfigurable intelligent surfaces in multisensory XR, CRAS, BCI, DLT and other 6G use cases.
  • Hardware and implementation challenges, PoC for reconfigurable intelligent surfaces in 6G networks.
  • Standardization trends and regulatory aspects of reconfigurable intelligent surfaces in 6G wireless communication systems.
  • Integration of reconfigurable intelligent surfaces with other 6G technologies like mobile-edge computing, cognitive radios, wireless localization, ISAC, etc.



  • Keshav Singh, National Sun Yat-sen University, Taiwan.
  • Mayur Katwe, Nanyang Technological University, Singapore.
  • Cunhua Pan, Southeast University, China.
  • Derrick Wing Kwan Ng, University of New South Wales, Sydney, Australia.
  • Omid Taghizadeh, Lenovo Deutschland GmbH, Wireless standards and research, Germany.
  • Chongwen Huang, Zhejiang University, Hangzhou, China.


  • Prof. Lajos Hanzo, University of Southamption, UK
  • Prof. Tiejun Cui, Southeast University, China
  • Prof. A. Lee Swindlehurst, University of California at Irvine, USA
  • Prof. Robert Schober, Friedrich-Alexander University of Erlangen-Nuremberg, Germany
  • Prof. Octavia A. Dobre, Memorial University of Newfoundland, Canada


  • Prof. Rui Zhang, National University of Singapore, Singapore
  • Prof. Marco Di Renzo, Universit´e Paris-Saclay, France
  • Prof. Shi Jin, Southeast University, China


  • Paper submission deadline: 29 July, 2023 12 August, 2023 (FIRM)
  • Notification of acceptance: September 15, 2023
  • Camera-ready paper submission: October 1, 2023

We look forward to receiving your submissions and welcoming you to the workshop.


The workshop accepts only original and previously unpublished papers. All submissions must be formatted in standard IEEE camera-ready format (double-column, 10pt font). The maximum number of printed pages is six including figures without incurring additional page charges (6 pages plus 1 additional page allowed with a charge for the one additional page of USD 100 if accepted).

Call for papers: CFP

Paper submission link: EDAS submission link


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